Research & Development
Innovation has always been the base on which SOMACIS competes on the international market. Innovation not only in the product but also in the process, through constant research and experimentation which isn’t uniquely directed towards introducing a new innovative product to the market, but also at experimenting the technology for future generations.
The strategy for growth and development in SOMACS has always been based on the investment of significant amounts of its annual turnover directly back into Research and Development projects. In fact, over the years, SOMACIS has developed strong relationships with important national and international research centers amongst which the laboratories of the major OEM worldwide and Italian Universities, in the electronics field, in the science of materials and industrial chemicals. Satisfying results gained from these partnerships have included important research projects and articles in numerous international scientific publications.
The quality of our work received recognition from the Ministry of Universities and Research which placed the SOMACIS Laboratory on the register of highly qualified external laboratories.
Thanks to the SOMACIS R&D personnel, made up of engineers, physicists and chemists, as well as to an avanguard laboratory, we are able to supply both our commercial and research partners with answers and support of the highest level.
The SOMACIS laboratory is equipped with a Scanning Electronic Microscope (SEM) with EDX micro-analysis and Alicona software for measuring the micro-rugosity of complex surfaces, a system for metallographic micro-sections and optical microscopes connected to the PC to study them, and equipments for thermo-mechanic analysis (DSC,TGA,TMA); all equipment used to check that the printed circuit boards conform to the IPC regulation.
The main R&D projects that SOMACIS is currently developing are for the production of optoelectronic circuits with integrated planar waveguides, chip-scale-package interfaces, and for further miniaturization of the circuit boards (HDI- High Density Interconnections) with tracks and insulations down to 20/20 micron.