Project Description

6 layers rigid-flex pcb with 4 flexible layers realized with SBU technology. Size 182.8 x 104.1 mm, track/insulation 62.5/62.5 µm, minimum through hole diameter 0.2 mm, blind and buried microvias 1-2, 2-3, 5-4, 6-5, BGA pad 75 µm, ENIG finishing.

 

 

 

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