Technology
Ball Grid Array (BGA)
The capability of minimizing the values of the distintcive parameters of the Ball Grid Array technology (BGA), is a basic requirement to give and adequate answer to the requests for increasing miniaturization, coming from quite all the electronic sectors.
SOMACIS is more than able to respect the most restrictive techinical requirements. Being nowdays BGA pitches of 0.5 mm, SOMACIS R&D laboratories already realized a BGA pitch of 0.3 mm, de facto exceeding the actual limits set by SMT (Surface Mounting Technology).
| Capabilities | ||
| Pitch* | Outer Layer | 400 μm |
| Inner Layer | 400 μm | |
| Pad** | Outer Layer | 320 μm |
| Inner Layer | 230 μm | |
| Track | Outer Layer | 30 μm |
| Inner Layer | 30 μm | |
| Insulation | Outer Layer | 30 μm |
| Inner Layer | 30 μm | |
| Vias Diameter | Laser | 75 μm |
| Mechanical | 75 μm | |
| * on customer request Pitch outer and inner layer 200 μm | ||
| ** on customer request Pad outer and inner layer 200 μm | ||
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