The mechanical drilling is tipically used to realize through all and blind vias, when these are not of critical dimensions and the dielectric thickness is sufficient.
With respect to the laser drilling, the mechanical drilling is cheaper but slower.
The critical factors in the mechanical drilling are drill bits and splinde, whose bad conditions can cause phenomenon like smearing o lo burring and even tools breakes.
To prevent these kind of problems, SOMACIS dedicates particular attention to periodical controls and substitutions of both drill bits and spindles in order to guarantee better risults.
|Via pads||External||300 μm|
|PCB Thickness||Max||4,2 mm|
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