The Laser drilling technology is tipically used to realize blind and buried vias of very reduced dimensions.
SOMACIS has laser drilling machineries, based both on Yag diodes and CO2 technologies, in all its production plants.
Laser drilling demands particular skill, in the setup of the machinery, and care, during the drilling phase, to prevent an execessive, and not wanted, erosion of the material (both dieletric and copper) not directly involved in the drilling.
SOMACIS has been one of the first pcb manufacurer to adopt the laser drilling technology so it has one of his excellences in this technology. On the last production where made some laser via holes of 40 µm of diameter.
|Vias Diameter||40 μm|
|Via pads||External||200 μm|
|PCB Thickness||Max||4,2 mm|
Request for information
(Fields marked with * are mandatory.)