The capabilities below represents what can be achieved in the SOMACIS plants.
Please note that the values for a specific project may depend on the actual build-up and material combination, on the required volumes, and on the chosen manufacturing location.
By consulting our experts you can check the manufacturability of your specific design.
| Advanced capabilities | |
|---|---|
| Lines/spaces | 25/25 µm (1/1 mil) |
| Max number of layers | > 50 |
| HDI | 7+N+7 |
| Laser vias | 40 µm (1,6 mil) |
| Mechanical vias | 50 µm (2 mil) |
| Laser via pad | 150 µm (6 mil) |
| Mechanical via pad | 250 µm (10 mil) |
| Mechanical via aspect ratio | 1:13 |
| Solder gap | 25 µm (1 mil) |
| Impedance control | +/-5% |
| Mechanical depth control | +/-5 µm (0,2 mil) |
| Max panel size | 640×570 mm (25×22″) |
| Min thickness flex material | 25 µm (1 mil) |
| Max copper thickness | 420 µm (12 oz) |
| Max PCB thickness | 8 mm (0,315″) |
| Materials | FR4, FR4 halogen free, FR4 HTg, polyimide, Rogers, Arlon, Nelco, Taconic, Megtron 4, Megtron 6, CIC, PTFE, RCC, BT resin, etc. |
| Finishes | ENIG, ENEPIG, EPIG, OSP, HAL Sn/Pb, HAL lead-free, immersion tin, immersion silver, electrolytic gold, etc. |
| Special technologis | Copper filled vias, resin filled via with zero dimple, embedded resistors and capacitors, metal backed and metal core, embedded copper coins, etc. |