Project Description
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8 layers rigid PCB with minimum lines and spaces 75 µm/75 µm, dimension 164 x 221 mm, 3 press cycles, filling copper, ENEPIG finishing, for telecom application.
Back to Products
8 layers rigid PCB with minimum lines and spaces 75 µm/75 µm, dimension 164 x 221 mm, 3 press cycles, filling copper, ENEPIG finishing, for telecom application.
